High-speed boards that work on the first spin.

High-speed digital, power, RF and edge-AI hardware — simulated before fabrication, supported through bring-up.

30 min · scope and fixed quote on the call · 4.8★ on Clutch

Illustrated top view of the EM-64 six layer board with BGA fanout, DDR5 fly-by routing and via stitching
DDR5 FLY-BY ROUTINGPCIE GEN460 GHZ MMWAVEIMPEDANCE CONTROLPDN ANALYSISEMI/EMC PRE-SCAN12-LAYER HDITHERMAL SIMULATIONBGA FANOUTDFM/DFT

9+ years

Shipping hardware

UK Ltd

Companies House #15835884

Reviewed

On Clutch and DesignRush

Altium · KiCad

Cadence-compatible deliverables

Selected work

Boards we've built.

Hover a board for the X-ray

01

12-layer NVIDIA Jetson SoM motherboard

Custom carrier and system board for an edge-AI product: high-speed SoM interfaces, power tree, and dense HDI routing across 12 layers.

Length-matched high-speed groups passed SI simulation before fab.

12 layer Jetson SoM carrier board with 260 pin connector, fanout and power tree

02

6-layer 60 GHz radar carrier

RK3399 with DDR4, ESP32-P4, ESP32-C6, and four BGT60TR13C 60 GHz radar sensors on one 6-layer board. Antenna feeds, isolation, and mixed-signal partitioning handled at layout.

Four mmWave front ends on one board with clean sensor separation.

60 GHz radar carrier board with four radar front ends, RK3399 and DDR4

03

Isolated and non-isolated power stages

Buck-boost and isolated flyback supplies designed with full protection, derating, and error-budget analysis, verified against worst-case tolerances.

Worst-case analysis done on paper before the first prototype.

Isolated flyback power supply board with transformer, isolation slots and screw terminals

More work available under NDA. Ask on the call.

Services

What we take on.

FULL PRODUCT

Idea to production. Architecture, schematic, layout, simulation, prototype bring-up, and production files. One accountable engineer end to end.

HIGH-SPEED LAYOUT

Send your schematic, get routed boards. DDR4/5, PCIe, GDDR6, USB3, Ethernet, with impedance control and length matching documented.

SI/PI + EMC REVIEW

Pre-fab design review with signal integrity, power integrity, and EMI/EMC simulation. Find respins before the fab does.

RF + MMWAVE

60 GHz radar, antenna integration, RF front ends, and the grounding discipline that makes them work.

Beyond PCB design

Elecmore is not only a PCB design company.

We already cover the whole product around the board, from the first requirement to production support. One accountable team across every discipline below, so nothing falls between suppliers.

36capabilities
across 7 disciplines

Product definition

An idea turned into a buildable, costed specification.

3 capabilities
  • Requirements engineering
  • Product feasibility
  • System architecture

Electronics & PCB

Circuits and boards, from schematic to routed layout.

5 capabilities
  • Electronics design
  • Schematic design
  • High-speed PCB design
  • PCB layout
  • Edge AI hardwareJetson · RK3588 · NPU

High-speed & RF

The physics that decides whether it works first time.

7 capabilities
  • Signal integrity
  • Power integrity
  • DDR4 / DDR5Memory routing
  • PCIe
  • RFFront ends & antennas
  • mmWave60 GHz radar
  • Thermal simulation

Firmware & software

The code that brings the hardware to life.

6 capabilities
  • Embedded firmware
  • STM32Arm Cortex-M
  • ESP32Wi-Fi & Bluetooth
  • Embedded Linux
  • Mobile application development
  • Web / cloud interfaces where required

Mechanical

The enclosure and everything the board has to fit.

2 capabilities
  • Mechanical design
  • Enclosure design

Prototype & test

First units built, brought up and proven.

7 capabilities
  • Prototype manufacturing
  • PCB fabrication and PCBA coordination
  • Hardware bring-up
  • Testing
  • Pre-compliance preparation
  • Certification support
  • Lifetime & reliability analysis

Manufacturing

Ready for volume, with the supply chain behind it.

6 capabilities
  • DFMDesign for manufacture
  • DFTDesign for test
  • BOM optimisation
  • Supplier coordination
  • Manufacturing coordination
  • Production support
Talk through your product

Need one discipline or all of them, the first call is the same: scope, risks and a fixed quote.

Complete product development

From requirements to production.

Elecmore can support the complete development of an electronic product, from early requirements and system architecture to electronics, firmware, mechanical design, prototypes, testing and manufacturing.

For technically demanding products, the same team can also handle high-speed PCB design, DDR4/5, PCIe, RF, signal integrity and power integrity.

Elecmore · product pipeline Stage 01 / 08 · Requirements

Stage 01 / 08

Define what the product must do.

Use cases, constraints, cost targets and compliance goals, checked for feasibility before any design starts.

  • Requirements spec
  • Feasibility check
  • System architecture

How the work runs

Design. Review. Manufacture.

Three phases, one accountable engineer. Nothing is handed to a fab until it has been simulated and reviewed by a human.

DESIGN REVIEW MANUFACTURE

SCHEMATIC & LAYOUT: architecture, part selection, schematic capture and impedance-controlled routing, from 2 to 12+ layers.

STACKUP FIRST: layer stack, impedance targets and BGA fanout are settled before a single track is routed.

EDA NATIVE: we work in your Altium or KiCad workspace, templates and libraries, or set them up for you. Cadence-compatible deliverables on request.

SIMULATE BEFORE COPPER: signal integrity, power integrity and thermal analysis run before fabrication, not after the first spin fails.

HUMAN REVIEW: every schematic is peer-reviewed and annotated by an experienced engineer before it moves to layout.

EMC PRE-SCAN: EMI and EMC risks are found on the bench-top model, with a written pre-compliance checklist you keep.

FULL FAB PACKAGE: Gerbers, BOM, pick and place and assembly drawings, plus the native source files. You own all of it.

FAB COORDINATED: trusted fabs and assembly houses, their DFM feedback handled by us, everything billed at cost with invoices shared.

BRING-UP: board on the bench, measured and firmware-ready, backed by a 12-month design warranty.

Edge AI hardware

Boards built for NPUs, not around them.

We design carriers and full systems for modern AI silicon: NVIDIA Jetson, Rockchip RK3588 and RK3399, NXP i.MX 8M Plus, AMD Xilinx Zynq and Versal, and GDDR6 memory subsystems. Power delivery, memory routing, and thermal design are handled as one problem, because on these boards they are one problem.

NVIDIA JETSON ROCKCHIP RK3588 NXP I.MX 8M PLUS AMD XILINX GDDR6 HAILO

ELECMORE

DS-4CH

RUN
VOLTS/DIV
TIME/DIV
BRING-UP CAPTURE200 mV/DIV · 2 ns/DIV
CH1 DDR5 CLK CH2 DQ EYE CH3 VDD RIPPLE CH4 NPU LOAD

POWER

Multi-rail PDN designed and simulated for NPU transient loads.

MEMORY

DDR4/5 and GDDR6 routed to spec with fly-by and point-to-point topologies.

THERMAL

Copper pours, via farms, and heatsink strategy simulated before you buy tooling.

Evidence, not promises

Simulated before it's fabricated.

Every power rail is solved for DC drop and current density before a single board is ordered. These are real captures from a recent build: the PDN analysis, the thermal and current-density check, and the board those simulations produced.

CST power delivery network simulation showing the VCC rail on a round board, with the supply path highlighted in red against blue copper pours

PDN · VCC RAIL

The VCC net traced through every pour and via, so the weak link in the delivery path is found on screen, not on the bench.

CST DC drop simulation of the same board, showing voltage distribution as a colour map from red at the source to green and blue at the far side

PDN · DC DROP

Voltage across the whole plane, measured in millivolts. Every load sees the rail it was specified for, at worst case.

Current density map across the ground plane of a six layer stackup, shown in amps per square millimetre with hot spots in orange and red

THERMAL · CURRENT DENSITY

Amps per square millimetre, layer by layer. Hot spots get more copper and more vias before the stackup is signed off.

The finished round green circuit board, assembled with three seven segment displays, a Winbond flash memory, tactile buttons and LED bar

THE BOARD · BUILT

The same board, assembled and working. Simulation done first means first-spin hardware and no surprise respin invoice.

Get this on your board

Simulation reports ship with every project.

Rugged by design

Built for heat, dust, vibration, and long service life.

For industrial, outdoor, and vehicle-mounted products we design to extended temperature ranges, derate every component, plan conformal coating and mechanical strain relief, and document the reliability decisions.

Enhanced Lifetime & Reliability Analysis

Increase your PCB life and warranty to 10–20 years.

A component-by-component assessment of your board against how it will really be used. You learn what limits its service life and what to change, before you commit to a long warranty.

  • Thermal-cycle and solder-joint reliability assessment where applicable
  • Physics-of-failure assessment of critical areas
  • Identification of components or mechanisms most likely to limit service life
  • Predicted life / margin where the available component data supports a quantitative calculation
  • Detailed manufacturing and reliability recommendations, including areas such as coating / protection where appropriate
  • Component derating review against your real operating profile: temperature, humidity, vibration and duty cycle
Book a reliability review Component by component · physics of failure

Sample certificate

Elecmore Ltd · Reliability Engineering

Certificate

of Enhanced Lifetime & Reliability Analysis

This certifies that the printed circuit assembly named below has completed a component-by-component lifetime and reliability assessment against its stated operating profile.

Assembly
Industrial controller, Rev B
Assessment
Component by component
Operating profile
−20 to +70 °C, 24/7
Target service life
16 years
Elecmore EngineeringReliability engineering · Ref. ELM-RA-0000

Where long PCB life matters

Some boards cannot be replaced in five years.

For space, defence and critical infrastructure, service life is a requirement, not a bonus. It has to be designed in, part by part, and proven before the first unit ships.

  • Space & satellites

    There is no repair once it launches. Thermal cycling in orbit and vacuum shape every material and solder-joint choice.

    Missions of 15+ years
  • Defence

    Platforms stay in service for decades, through shock, vibration and wide temperature swings, and outlive the parts they were built with.

    Service lives of 20–30 years
  • Aerospace & avionics

    Constant thermal cycles between ground and altitude, plus vibration, and every failure is costly to diagnose and recertify.

    Airframes flying 20+ years
  • Energy & infrastructure

    Inverters, substations and smart meters run 24/7 outdoors, where a site visit is the most expensive repair there is.

    Expected 15–25 years
  • Rail & automotive

    Years of vibration and heat across a whole fleet, where one weak solder joint becomes thousands of warranty claims.

    Fleets running 15–30 years
  • Medical & industrial

    Equipment stays installed for a decade or more, and downtime or a recall costs far more than designing in margin.

    Installed 10–15+ years

Predicted service life

16years

Target life once the life-limiting parts and mechanisms are found and designed out, against a typical unassessed board.

  • After Elecmore analysis
  • Typical unassessed design
10–20 YEAR TARGET BAND 100%75%50%25%0048121620YEARS IN SERVICERELIABILITY 16-YR TARGET

Certificate and curves are illustrative. Achievable life depends on the component data, operating profile and environment; every report states which results are quantitative and which are engineering judgement.

Process

How a board gets built.

  1. 01

    Discover

    Requirements, risks, and a written spec.

  2. 02

    Architect

    Block diagram, part selection, cost targets.

  3. 03

    Schematic

    Peer-reviewed, annotated, simulation-ready.

  4. 04

    Simulate

    SI, PI, and thermal before any copper.

  5. 05

    Layout

    Stackup, routing, impedance control.

  6. 06

    Prototype

    Fab and assembly coordinated, at cost.

  7. 07

    Bring-up

    Board on the bench, measured, firmware-ready.

  8. 08

    Production files

    Gerbers, BOM, test docs. Yours.

Pricing

Fixed price. Scoped upfront. Fixes included.

You pay for a finished design, not for hours. Fabrication, assembly, and components are billed at cost, separately.

REVIEW

$950

3-5 days

Expert review of your existing schematic and layout: SI/PI, EMC risks, DFM, and a written fix list.

SMALL

$5k-9k

About 1 week

Sensor boards, IoT devices, breakouts, simple controllers.

MEDIUM

$15k-25k

2-3 weeks

Product boards, power electronics, communication modules, 4-8 layers.

LARGE

$35k+

3-6 weeks

High-speed, HDI, DDR, PCIe, RF and mmWave, 8-12+ layers, full systems.

RETAINER

Embedded hardware partner from $4k/month.

Reserved weekly hours, priority turnaround, Slack access.

+ FAB COST, billed at cost with invoices shared.

Native Altium or KiCad files

Full fab package: Gerbers, BOM, pick and place, assembly drawings

SI/PI simulation report

Bring-up guide with pin maps

EMC pre-compliance checklist

Reviews

What clients say.

Verified reviews from our Clutch and DesignRush profiles. Click any review to read it in full at the source.

CLUTCH★★★★★4.8 / 53 reviews DESIGNRUSH★★★★★4.5 / 52 reviews
★★★★★ GOOGLE
“Elecmore has been one of the most skilled and talented engineering partners I've worked with in recent years. Their PCB and electronics expertise is unmatched, and I highly recommend them to anyone. Looking forward to collaborating again!”

Edward A.

Google review · Oct 2025

★★★★★ CLUTCH
“I've been impressed with the ease of working together.”

IoT development, electrical engineering and PCBA design for a consumer meditation device. App v1 and embedded v2 delivered; PCBA manufactured and in user testing.

Founder

Zenstone · Oct 2025

★★★★★ DESIGNRUSH
“ELECMORE focused on fixing the core problems first. They rebuilt parts of the software so features could be added faster and with less risk… ELECMORE helped turn a fragile system into something stable we can build on.”

Ankur Ghai

Co-Founder, N-Fungibles · Dec 2025

★★★★★ DESIGNRUSH
“They built a custom software setup that puts everything in one place… Now we can track things faster, our team doesn't chase files, and clients get updates way quicker than before. They are easy to talk to and fix things fast.”

Michael Brown

CEO, Independent Solutions · Dec 2025

★★★★★ CLUTCH
“Their project management was solid.”

Rebuilt the backend of an ESG reporting platform: faster load times, significantly fewer errors and smoother client onboarding.

Co-Founder

EXO Innovation & Sustainability · Dec 2025

★★★★★ CLUTCH
“I am happy with the partnership.”

Custom inventory and order-management platform with real-time tracking. Reporting time cut from hours to minutes.

Co-Founder

Knobby · Dec 2025

FAQ

Straight answers.

How do we start?

Book the intro call. Bring an idea, a schematic, or a half-finished layout. You get a scope, a fixed quote, and a start date within two working days.

Do you sign NDAs?

Yes, standard practice. Send yours or use ours. Most of our work ships under NDA.

Who owns the design files?

You do, fully. Native source files, libraries, and outputs transfer on final payment. No lock-in.

Can you work in our Altium or KiCad setup?

Yes. We work inside your workspace, templates, and libraries, or set them up for you. Cadence-compatible deliverables on request.

Do you handle fabrication and assembly?

Yes, coordinated with trusted fabs and assembly houses. We handle their DFM feedback and bill everything at cost, with invoices shared.

What timezone do you work in?

Elecmore is a UK company. Engineers overlap with US mornings and all EU hours. Slack replies land inside one working day.

Send the idea. Get back a board.

Book a 30-minute intro call

NO COMMITMENT · SCOPE AND FIXED QUOTE ON THE CALL